Electronic grade SiC/Al composite material

Material Introduction
Electronic grade SiC/Al composite material is a relatively special type of SiC/Al composite material system, which has a large demand in IGBT substrates and TR module housings. The material is required to have a density close to 100%, an expansion coefficient<6ppm, a thermal conductivity>220W/mk, a bending strength>500MPa, and dimensional stability under force/heat coupling. In addition, due to its high thermal conductivity, specific strength, specific modulus, and adjustable coefficient of thermal expansion, it is widely used in the fields of electronics and automobiles. This product is prepared using self exhaust pressure infiltration technology without metallographic defects, and has independent intellectual property rights. It is a low-cost new variety in the field of electronic packaging in China. This material technology won the 2008 the State Technological Innovation Award.

Application Area

Concentrated application in high-power, high-density, and highly reliable electronic/optoelectronic fields, such as semiconductor and power electronics packaging, new energy vehicles, etc.

  • IGBT for new energy vehicles
  • Chip module/optical module
  • Server chip
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